Document reflowing technique
Reflowing digital ink annotations
SU-8: a photoresist for high-aspect-ratio and 3D submicron lithography
Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging
Study of interaction between Cu-Sn and Ni-Sn interfacial reactions by Ni-Sn3.5Ag-Cu sandwich structure
A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy
Thermal stability of electroless-nickel/solder interface: Part A. interfacial chemistry and microstructure
Research advances in nano-composite solders
TOPICAL REVIEW: Ultrafast nonlinear all-optical processes in silicon-on-insulator waveguides
Effect of PCB finish on the reliability and wettability of ball grid array packages
